Numerical modeling and experimental validation of two-phase microfluidic cooling in silicon devices for vertical integration of microelectronics

Lorenzini, Daniel M; Joshi, Yogendra Kumar

doi:10.1016/j.ijheatmasstransfer.2019.04.036

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Numerical modeling and experimental validation of two-phase microfluidic cooling in silicon devices for vertical integration of microelectronics

Author(s): Daniel Lorenzini , Yogendra Joshi

Publication date Created: August 2019

Publication date (Print): August 2019

Journal: International Journal of Heat and Mass Transfer

Publisher: Elsevier BV

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Title: International Journal of Heat and Mass Transfer

Abbreviated Title: International Journal of Heat and Mass Transfer

Publisher: Elsevier BV

ISSN (Print): 00179310

Publication date Created: August 2019

Publication date (Print): August 2019

Volume: 138

Pages: 194-207

Article

DOI: 10.1016/j.ijheatmasstransfer.2019.04.036

SO-VID: d52c9838-4a65-40d2-beee-74fd7894672f

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https://www.elsevier.com/tdm/userlicense/1.0/

http://www.elsevier.com/open-access/userlicense/1.0/

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Numerical modeling and experimental validation of two-phase microfluidic cooling in silicon devices for vertical integration of microelectronics

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Numerical Algebra, Matrix Theory, Differential-Algebraic Equations, and Control Theory

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