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      Embedded Cooling of High-Heat-Flux Hotspots Using Self-Adaptive Microchannel/Pin-Fin Hybrid Heat Sink

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          High-performance heat sinking for VLSI

          D.B. Tuckerman, R.F.W. Pease (1981)
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            Cramming More Components Onto Integrated Circuits

            G.E. Moore (1998)
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              The chips are down for Moore's law.

              M Mitchell Waldrop (2016)
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                Author and article information

                Contributors
                Journal
                Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
                Abbreviated Title: IEEE Trans. Compon., Packag. Manufact. Technol.
                Publisher: Institute of Electrical and Electronics Engineers (IEEE)
                ISSN (Print): 2156-3950
                ISSN (Electronic): 2156-3985
                Publication date Created: October 2022
                Publication date (Print): October 2022
                Volume: 12
                Issue: 10
                Pages: 1627-1635
                Affiliations
                [1 ]MIIT Key Laboratory of Thermal Control of Electronic Equipment, School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing, China
                Article
                DOI: 10.1109/TCPMT.2022.3211009
                SO-VID: 0b4a8a33-1a66-47d5-b475-d05b4a5de8aa
                Copyright © © 2022
                License:

                https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html

                https://doi.org/10.15223/policy-029

                https://doi.org/10.15223/policy-037

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