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Dielectric Films for Advanced Microelectronics
edited_book
Editor(s):
Mikhail R. Baklanov
,
Martin L. Green
,
Karen Maex
Publication date
(Print):
February 16 2007
Publisher:
John Wiley & Sons, Ltd
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Journal of Advanced Ceramics
Author and book information
Book
ISBN (Electronic):
9780470017944
ISBN (Print):
9780470013601
Publication date (Print):
February 16 2007
DOI:
10.1002/9780470017944
SO-VID:
bea4cd54-dc35-4948-b7d2-cc342e88c407
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Book chapters
pp. i
Front Matter
pp. 1
Low and Ultralow Dielectric Constant Films Prepared by Plasma-enhanced Chemical Vapor Deposition
pp. 33
Spin-on Dielectric Materials
pp. 85
Porosity of Low Dielectric Constant Materials
pp. 137
Mechanical and Transport Properties of Low-k Dielectrics
pp. 199
Integration of Low-k Dielectric Films in Damascene Processes
pp. 251
ONO Structures and Oxynitrides in Modern Microelectronics: Material Science, Characterization and Application
pp. 297
Material Engineering of High-k Gate Dielectrics
pp. 337
Physical Characterization of Ultra-thin High-k Dielectric
pp. 371
Electrical Characterization of Advanced Gate Dielectrics
pp. 437
Integration Issues of High-k Gate Dielectrics
pp. 453
Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects
pp. 477
Index
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