A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions

Yang, Hung-Chun; Chiu, Tz-Cheng

doi:10.1016/j.microrel.2021.114086

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A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions

Author(s): Hung-Chun Yang , Tz-Cheng Chiu

Publication date Created: April 2021

Publication date (Print): April 2021

Journal: Microelectronics Reliability

Publisher: Elsevier BV

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Title: Microelectronics Reliability

Abbreviated Title: Microelectronics Reliability

Publisher: Elsevier BV

ISSN (Print): 00262714

Publication date Created: April 2021

Publication date (Print): April 2021

Volume: 119

Page: 114086

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DOI: 10.1016/j.microrel.2021.114086

SO-VID: bfa5c286-82bd-4022-b7de-c89091d8e019

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A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions

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