Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates

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Journal

Title: Microelectronics Reliability

Abbreviated Title: Microelectronics Reliability

Publisher: Elsevier BV

ISSN (Print): 00262714

Publication date Created: May 2014

Publication date (Print): May 2014

Volume: 54

Issue: 5

Pages: 932-938

Article

DOI: 10.1016/j.microrel.2014.01.008

SO-VID: 8b8608a9-ea77-41c2-ad75-80b054b1a318

License:

https://www.elsevier.com/tdm/userlicense/1.0/

http://creativecommons.org/licenses/by-nc-sa/3.0/

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