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      Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

      Author(s): , , , ,
      Publication date Created:
      Publication date (Print):
      Journal: Materials Science and Engineering: A
      Publisher: Elsevier BV

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          Journal
          Title: Materials Science and Engineering: A
          Abbreviated Title: Materials Science and Engineering: A
          Publisher: Elsevier BV
          ISSN (Print): 09215093
          Publication date Created: November 2011
          Publication date (Print): November 2011
          Volume: 529
          Pages: 468-478
          Article
          DOI: 10.1016/j.msea.2011.09.063
          SO-VID: 04678661-2ddf-4753-9e95-3b44ce06b0c7
          Copyright © © 2011
          License:

          https://www.elsevier.com/tdm/userlicense/1.0/

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