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      Bonding of silicon wafers for silicon‐on‐insulator

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      Journal of Applied Physics
      AIP Publishing

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          Most cited references11

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          Field Assisted Glass‐Metal Sealing

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            Wafer bonding for silicon‐on‐insulator technologies

            J. Lasky (1986)
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              Silicon‐to‐silicon direct bonding method

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                Author and article information

                Journal
                Journal of Applied Physics
                Journal of Applied Physics
                AIP Publishing
                0021-8979
                1089-7550
                November 15 1988
                November 15 1988
                : 64
                : 10
                : 4943-4950
                Article
                10.1063/1.342443
                36731841-287e-48c8-8fc9-a96e712afaba
                © 1988
                History

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