Silicon‐to‐silicon direct bonding method

Shimbo, M.; Furukawa, K; Fukuda, K.; Tanzawa, K

doi:10.1063/1.337750

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Silicon‐to‐silicon direct bonding method

Author(s): M. Shimbo , K. Furukawa , K. Fukuda , K. Tanzawa

Publication date Created: October 15 1986

Publication date (Print): October 15 1986

Journal: Journal of Applied Physics

Publisher: AIP Publishing

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Wafer bonding for silicon‐on‐insulator technologies

J. Lasky (1986)

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The Evolution of the Theory for the Voltage-Current Characteristic of P-N Junctions

J Moll (1958)

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Author and article information

Journal

Title: Journal of Applied Physics

Abbreviated Title: Journal of Applied Physics

Publisher: AIP Publishing

ISSN (Print): 0021-8979

ISSN (Electronic): 1089-7550

Publication date Created: October 15 1986

Publication date (Print): October 15 1986

Volume: 60

Issue: 8

Pages: 2987-2989

Article

DOI: 10.1063/1.337750

SO-VID: b74377a6-1126-4607-98cd-852db8389089

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