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      Enhancement-Mode GaN Transistor Technology for Harsh Environment Operation

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          High-temperature electronics - a role for wide bandgap semiconductors?

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            Testing the Temperature Limits of GaN-Based HEMT Devices

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              InAlN/GaN HEMTs for Operation in the 1000 $^{\circ} \hbox{C}$ Regime: A First Experiment

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                Author and article information

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                Journal
                IEEE Electron Device Letters
                IEEE Electron Device Lett.
                Institute of Electrical and Electronics Engineers (IEEE)
                0741-3106
                1558-0563
                July 2023
                July 2023
                : 44
                : 7
                : 1068-1071
                Affiliations
                [1 ]Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA, USA
                [2 ]Advanced Materials Research Center, Technology Innovation Institute, Abu Dhabi, United Arab Emirates
                [3 ]Department of Electrical and Computer Engineering, Rice University, Houston, TX, USA
                [4 ]Department of Electrical and Electronic Engineering, Bangladesh University of Engineering and Technology, Dhaka, Bangladesh
                [5 ]Department of Computer Science, Johns Hopkins University, Baltimore, MD, USA
                [6 ]Department of Aeronautics and Astronautics, Stanford University, Stanford, CA, USA
                [7 ]Smart Sensing and Electronics Systems Branch, NASA Glenn Research Center, Cleveland, OH, USA
                Article
                10.1109/LED.2023.3279813
                d7eef497-6978-4977-bafc-2ebc1301e012
                © 2023

                https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html

                https://doi.org/10.15223/policy-029

                https://doi.org/10.15223/policy-037

                History

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