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      Low‐Temperature Atomic Layer Deposition of High‐ k SbO x for Thin Film Transistors

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          Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors.

          Transparent electronic devices formed on flexible substrates are expected to meet emerging technological demands where silicon-based electronics cannot provide a solution. Examples of active flexible applications include paper displays and wearable computers. So far, mainly flexible devices based on hydrogenated amorphous silicon (a-Si:H) and organic semiconductors have been investigated. However, the performance of these devices has been insufficient for use as transistors in practical computers and current-driven organic light-emitting diode displays. Fabricating high-performance devices is challenging, owing to a trade-off between processing temperature and device performance. Here, we propose to solve this problem by using a novel semiconducting material--namely, a transparent amorphous oxide semiconductor from the In-Ga-Zn-O system (a-IGZO)--for the active channel in transparent thin-film transistors (TTFTs). The a-IGZO is deposited on polyethylene terephthalate at room temperature and exhibits Hall effect mobilities exceeding 10 cm2 V(-1) s(-1), which is an order of magnitude larger than for hydrogenated amorphous silicon. TTFTs fabricated on polyethylene terephthalate sheets exhibit saturation mobilities of 6-9 cm2 V(-1) s(-1), and device characteristics are stable during repetitive bending of the TTFT sheet.
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            High-k Gate Dielectrics for Emerging Flexible and Stretchable Electronics

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              Thin-Film Transistors

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                Author and article information

                Contributors
                (View ORCID Profile)
                Journal
                Advanced Electronic Materials
                Adv Elect Materials
                Wiley
                2199-160X
                2199-160X
                July 2022
                March 04 2022
                July 2022
                : 8
                : 7
                : 2101334
                Affiliations
                [1 ]Institute for Metallic Materials Leibniz Institute of Solid State and Materials Science 01069 Dresden Germany
                [2 ]Institute of Materials Science Technische Universität Dresden 01062 Dresden Germany
                [3 ]Key Laboratory of Advanced Display and System Application Ministry of Education, Shanghai University Shanghai 200072 China
                [4 ]Department of Physics University of Jyvaskyla Jyväskylä FI‐40014 Finland
                Article
                10.1002/aelm.202101334
                8e8a7385-0cbf-42c4-b4d7-a9e9e8838953
                © 2022

                http://creativecommons.org/licenses/by-nc-nd/4.0/

                http://doi.wiley.com/10.1002/tdm_license_1.1

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