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      Highly Sensitive Iontronic Pressure Sensor with Side‐by‐Side Package Based on Alveoli and Arch Structure

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          Abstract

          Flexible pressure sensors play a significant role in wearable devices and electronic skin. Iontronic pressure sensors with high sensitivity, wide measurement range, and high resolution can meet requirements. Based on the significant deformation characteristics of alveoli to improve compressibility, and the ability of the arch to disperse vertical pressure into horizontal thrust to increase contact area, a graded hollow ball arch (GHBA) microstructure is proposed, greatly improving sensitivity. The fabrication of GHBA ingeniously employs a double‐sided structure. One side uses mold casting to create convex structures, while the other utilizes the evaporation of moisture during the curing process to form concave structures. At the same time, a novel side‐by‐side package structure is proposed, ensuring pressure on flexible substrate is maximally transferred to the GHBA microstructure. Within the range of 0.2 Pa–300 kPa, the iontronic pressure sensor achieves a maximum sensitivity of 10 420.8 kPa −1, pressure resolution of 0.1% under the pressure of 100 kPa, and rapid response/recovery time of 40/35 ms. In wearable devices, it is capable of monitoring dumbbell curl exercises and wirelessly correcting sitting positions. In electronic skin, it can non‐contactly detect the location of the wind source and achieve object classification prediction when combined with the CNN model.

          Abstract

          Iontronic pressure sensors possess high capacitance characteristics. Based on the alveoli structure to improve compressibility and arch structure to disperse vertical pressure into horizontal thrust, a graded hollow ball arch microstructure is proposed, greatly improving sensitivity to 10 420.8 kPa ‐1. When combined with circuits and machine learning, the iontronic pressure sensor can wirelessly correct the sitting position and achieve object classification prediction.

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          Author and article information

          Contributors
          lfche@zju.edu.cn
          Journal
          Adv Sci (Weinh)
          Adv Sci (Weinh)
          10.1002/(ISSN)2198-3844
          ADVS
          Advanced Science
          John Wiley and Sons Inc. (Hoboken )
          2198-3844
          15 March 2024
          June 2024
          : 11
          : 24 ( doiID: 10.1002/advs.v11.24 )
          : 2309407
          Affiliations
          [ 1 ] College of Information Science and Electronic Engineering Zhejiang University Hangzhou 310027 China
          [ 2 ] Center for Microelectronics Shaoxing Institute Zhejiang University Shaoxing 312035 China
          Author notes
          [*] [* ]E‐mail: lfche@ 123456zju.edu.cn

          Author information
          https://orcid.org/0009-0002-9270-5966
          https://orcid.org/0000-0002-3305-553X
          Article
          ADVS7726
          10.1002/advs.202309407
          11199976
          38491739
          32c3e673-40a4-4162-86fa-663f6376e19f
          © 2024 The Authors. Advanced Science published by Wiley‐VCH GmbH

          This is an open access article under the terms of the http://creativecommons.org/licenses/by/4.0/ License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.

          History
          : 27 January 2024
          : 04 December 2023
          Page count
          Figures: 6, Tables: 0, Pages: 11, Words: 7204
          Funding
          Funded by: Department of Science and Technology of Zhejiang Province
          Award ID: 2021R52011
          Categories
          Research Article
          Research Articles
          Custom metadata
          2.0
          June 26, 2024
          Converter:WILEY_ML3GV2_TO_JATSPMC version:6.4.4 mode:remove_FC converted:26.06.2024

          double‐sided microstructure,graded hollow ball arch,iontronic,side‐by‐side package

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