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      Active Power Cycling Test Bench for SiC Power MOSFETs—Principles, Design, and Implementation

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          Selected failure mechanisms of modern power modules

          Mauro Ciappa (2002)
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            $\hbox{CrN}_{\rm x}$ Films Prepared by DC Magnetron Sputtering and High-Power Pulsed Magnetron Sputtering: A Comparative Study

            Grzegorz Greczynski, Lars Hultman, Jens Møller Jensen (2010)
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              A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules

              Amir Bahman, Ke Ma, Frede Blaabjerg (2018)
              Article 0 comments Cited 12 times – based on 0 reviews     Review now
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                Author and article information

                Contributors
                Sebastian Baba: (View ORCID Profile)
                Andrzej Gieraltowski: (View ORCID Profile)
                Marek Jasinski: (View ORCID Profile)
                Frede Blaabjerg: (View ORCID Profile)
                Amir Sajjad Bahman: (View ORCID Profile)
                Journal
                Title: IEEE Transactions on Power Electronics
                Abbreviated Title: IEEE Trans. Power Electron.
                Publisher: Institute of Electrical and Electronics Engineers (IEEE)
                ISSN (Print): 0885-8993
                ISSN (Electronic): 1941-0107
                Publication date Created: March 2021
                Publication date (Print): March 2021
                Volume: 36
                Issue: 3
                Pages: 2661-2675
                Article
                DOI: 10.1109/TPEL.2020.3018535
                SO-VID: 2ede6964-eb95-4203-8766-146761ecc11d
                Copyright © © 2021
                License:

                https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html

                https://doi.org/10.15223/policy-029

                https://doi.org/10.15223/policy-037

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