This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (SBU) by Fourier transform infrared (FTIR) analysis.
The DC of each adhesive system was analyzed with six experimental different protocols: (1) immediate light curing for 10 s without solvent volatilization; (2) 10 s solvent volatilization with air stream plus 10 s light curing; (3) 60 s solvent volatilization with air stream plus 10 s light curing; (4) immediate light curing for 20 s without solvent volatilization; (5) 10 s solvent volatilization with air stream plus 20 s light curing; and (6) 60 s solvent volatilization with air stream plus 20 s light curing. FTIR spectra were obtained, and the DC was calculated by comparing the ratio of aliphatic/aromatic double carbon bonds before and after light activation (Bluephase 20i). The DC means were analyzed by three-way analysis of variance (ANOVA) and post hoc Tukey tests ( α = 0.05).
Three-way ANOVA showed statistically significant adhesive, air-drying, and light-cured time ( p < 0.001). In general, there was a trend of increased DC when the adhesives were dried and cured for longer times, but that was not observed for all the adhesives tested. The acetone-based adhesive systems require an air-drying prior to light activation. The light-curing time of 20 s increases the DC of all materials tested.