Wen-Dung Hsu:
ORCID: http://orcid.org/0000-0002-4634-8059
wendung@mail.ncku.edu.tw
Bernard Haochih Liu:
ORCID: http://orcid.org/0000-0002-5914-5461
hcliu@mail.ncku.edu.tw
Chan-Shan Yang: csyang@ntnu.edu.tw
Chuan-Feng Shih:
ORCID: http://orcid.org/0000-0002-8503-7210
cfshih@mail.ncku.edu.tw
Journal ID (nlm-ta): Nat Commun
Journal ID (iso-abbrev): Nat Commun
Title:
Nature Communications
Publisher:
Nature Publishing Group UK
(London
)
ISSN
(Electronic):
2041-1723
Publication date
(Electronic):
29
May
2024
Publication date PMC-release: 29
May
2024
Publication date Collection: 2024
Volume: 15
Electronic Location Identifier: 4554
Affiliations
[1
]Department of Electrical Engineering, National Cheng Kung University, (
https://ror.org/01b8kcc49)
Tainan, 70101 Taiwan
[2
]Department of Materials Science and Engineering, National Cheng Kung University,
(
https://ror.org/01b8kcc49)
Tainan, 70101 Taiwan
[3
]Applied High Entropy Technology (AHET) Center, National Cheng Kung University, (
https://ror.org/01b8kcc49)
Tainan, 70101 Taiwan
[4
]Program on Semiconductor Packaging and Testing, Academy of Innovative Semiconductor
and Sustainable Manufacture, National Cheng Kung University, (
https://ror.org/01b8kcc49)
Tainan, 70101 Taiwan
[5
]Institute and Undergraduate Program of Electro-Optical Engineering, National Taiwan
Normal University, (
https://ror.org/059dkdx38)
Taipei, 11677 Taiwan
[6
]Department of Materials Science and Engineering, The University of Tennessee, (
https://ror.org/020f3ap87)
Knoxville, TN 37996 USA
Author information
Article
Publisher ID:
49035
DOI: 10.1038/s41467-024-49035-0
PMC ID: 11136967
PubMed ID: 38811587
SO-VID: d07514fd-d0d1-4457-95d4-60b4d4106f37
Copyright © © The Author(s) 2024
License:
Open Access This article is licensed under a Creative Commons Attribution 4.0 International License,
which permits use, sharing, adaptation, distribution and reproduction in any medium
or format, as long as you give appropriate credit to the original author(s) and the
source, provide a link to the Creative Commons licence, and indicate if changes were
made. The images or other third party material in this article are included in the
article’s Creative Commons licence, unless indicated otherwise in a credit line to
the material. If material is not included in the article’s Creative Commons licence
and your intended use is not permitted by statutory regulation or exceeds the permitted
use, you will need to obtain permission directly from the copyright holder. To view
a copy of this licence, visit
http://creativecommons.org/licenses/by/4.0/.
Funded by: FundRef https://doi.org/10.13039/501100004663, Ministry of Science and Technology, Taiwan (Ministry of Science and Technology of
Taiwan);
Award ID: NSTC 112-2224-E-006-004
Award ID: NSTC 112-2221-E-006-076
Award Recipient
:
Chuan-Feng Shih
Funded by: Taiwan Semiconductor Research Institute JDP113-Y1-028
Funded by: FundRef https://doi.org/10.13039/100000001, National Science Foundation (NSF);
Award ID: DMR-1611180
Award ID: DMR-1809640
Award ID: DMR-2226508
Award Recipient
:
Peter K. Liaw
Funded by: Army Office Project W911NF-13-1-0438 and W911NF-19-2-0049