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      Phonon Transport at Crystalline Si/Ge Interfaces: The Role of Interfacial Modes of Vibration

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      1 , a , 1 , 2
      Scientific Reports
      Nature Publishing Group

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          Abstract

          We studied the modal contributions to heat conduction at crystalline Si and crystalline Ge interfaces and found that more than 15% of the interface conductance arises from less than 0.1% of the modes in the structure. Using the recently developed interface conductance modal analysis (ICMA) method along with a new complimentary methodology, we mapped the correlations between modes, which revealed that a small group of interfacial modes, which exist between 12–13 THz, exhibit extremely strong correlation with other modes in the system. It is found that these interfacial modes (e.g., modes with large eigen vectors for interfacial atoms) are enabled by the degree of anharmonicity near the interface, which is higher than in the bulk, and therefore allows this small group of modes to couple to all others. The analysis sheds light on the nature of localized vibrations at interfaces and can be enlightening for other investigations of localization.

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          Advances in the measurement and computation of thermal phonon transport properties

          A. Minnich (2015)
          Heat conduction by phonons is a ubiquitous process that incorporates a wide range of physics and plays an essential role in applications ranging from space power generation to LED lighting. Heat conduction has been studied for over two hundred years, yet many of the microscopic details have remained unknown in most crystalline solids, including which phonon-phonon interactions are primarily responsible for thermal resistance and how heat is distributed among the broad thermal spectrum. This lack of knowledge was the result of limitations on the available tools to study heat conduction. However, recent advances in both computation and experiment are enabling an unprecedented microscopic view of thermal transport by phonons in both bulk and nanostructured crystals, from the level of atomic bonding to mesoscopic transport in complex devices. In this topical review, we examine these techniques and the microscopic insights gained into the science and engineering of heat conduction.
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            Author and article information

            Journal
            Sci Rep
            Sci Rep
            Scientific Reports
            Nature Publishing Group
            2045-2322
            16 March 2016
            2016
            : 6
            : 23139
            Affiliations
            [1 ]George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology , Atlanta GA, 30332, USA
            [2 ]School of Materials Science and Engineering, Georgia Institute of Technology , Atlanta GA, 30332, USA.
            Author notes
            Article
            srep23139
            10.1038/srep23139
            4793224
            26979787
            b039ba64-b920-4c31-8370-785a38405404
            Copyright © 2016, Macmillan Publishers Limited

            This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/

            History
            : 13 October 2015
            : 25 February 2016
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