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      Steep-slope vertical-transport transistors built from sub-5 nm Thin van der Waals heterostructures

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          Abstract

          Two-dimensional (2D) semiconductor-based vertical-transport field-effect transistors (VTFETs) – in which the current flows perpendicularly to the substrate surface direction – are in the drive to surmount the stringent downscaling constraints faced by the conventional planar FETs. However, low-power device operation with a sub-60 mV/dec subthreshold swing (SS) at room temperature along with an ultra-scaled channel length remains challenging for 2D semiconductor-based VTFETs. Here, we report steep-slope VTFETs that combine a gate-controllable van der Waals heterojunction and a metal-filamentary threshold switch (TS), featuring a vertical transport channel thinner than 5 nm and sub-thermionic turn-on characteristics. The integrated TS-VTFETs were realised with efficient current switching behaviours, exhibiting a current modulation ratio exceeding 1 × 10 8 and an average sub-60 mV/dec SS over 6 decades of drain current. The proposed TS-VTFETs with excellent area- and energy-efficiency could help to tackle the performance degradation-device downscaling dilemma faced by logic transistor technologies.

          Abstract

          2D vertical transport transistors (VTFETs) may promote the downscaling of electronic devices, but their performance is usually restricted by the thermionic limit. Here, the authors report the realization of short-channel steep-slope VTFETs based on MoS 2/MoTe 2 heterojunctions integrated with resistance threshold switching cells.

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          Most cited references38

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          Tunnel field-effect transistors as energy-efficient electronic switches.

          Power dissipation is a fundamental problem for nanoelectronic circuits. Scaling the supply voltage reduces the energy needed for switching, but the field-effect transistors (FETs) in today's integrated circuits require at least 60 mV of gate voltage to increase the current by one order of magnitude at room temperature. Tunnel FETs avoid this limit by using quantum-mechanical band-to-band tunnelling, rather than thermal injection, to inject charge carriers into the device channel. Tunnel FETs based on ultrathin semiconducting films or nanowires could achieve a 100-fold power reduction over complementary metal-oxide-semiconductor (CMOS) transistors, so integrating tunnel FETs with CMOS technology could improve low-power integrated circuits. © 2011 Macmillan Publishers Limited. All rights reserved
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            Graphene and two-dimensional materials for silicon technology

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              Vertically stacked multi-heterostructures of layered materials for logic transistors and complementary inverters

              The layered materials such as graphene have attracted considerable interest for future electronics. Here we report the vertical integration of multi-heterostructures of layered materials to enable high current density vertical field-effect transistors (VFETs). An n-channel VFET is created by sandwiching few-layer molybdenum disulfide (MoS2) as the semiconducting channel between a monolayer graphene and a metal thin film. The VFETs exhibit a room temperature on-off ratio >103, while at same time deliver a high current density up to 5,000 A/cm2, sufficient for high performance logic applications. This study offers a general strategy for the vertical integration of various layered materials to obtain both p- and n-channel transistors for complementary logic functions. A complementary inverter with larger than unit voltage gain is demonstrated by vertically stacking the layered materials of graphene, Bi2Sr2Co2O8 (p-channel), graphene, MoS2 (n-channel), and metal thin film in sequence. The ability to simultaneously achieve high on-off ratio, high current density, and logic integration in the vertically stacked multi-heterostructures can open up a new dimension for future electronics to enable three-dimensional integration.
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                Author and article information

                Contributors
                zhdluo@xidian.edu.cn
                xuetaogan@nwpu.edu.cn
                xdliuyan@xidian.edu.cn
                Journal
                Nat Commun
                Nat Commun
                Nature Communications
                Nature Publishing Group UK (London )
                2041-1723
                7 February 2024
                7 February 2024
                2024
                : 15
                : 1138
                Affiliations
                [1 ]State Key Discipline Laboratory of Wide Band Gap Semiconductor Technology, School of Microelectronics, Xidian University, ( https://ror.org/05s92vm98) Xi’an, 710071 China
                [2 ]GRID grid.440736.2, ISNI 0000 0001 0707 115X, Hangzhou Institute of Technology, , Xidian University, ; Hangzhou, 311200 China
                [3 ]ZJU-UIUC Institute, International Campus, Zhejiang University, ( https://ror.org/00a2xv884) Haining, 314400 China
                [4 ]GRID grid.440588.5, ISNI 0000 0001 0307 1240, Key Laboratory of Light Field Manipulation and Information Acquisition, Ministry of Industry and Information Technology, and Shaanxi Key Laboratory of Optical Information Technology, School of Physical Science and Technology, , Northwestern Polytechnical University, ; Xi’an, 710129 China
                [5 ]School of Materials Science and Engineering, UNSW Sydney, ( https://ror.org/03r8z3t63) Sydney, NSW 2052 Australia
                [6 ]GRID grid.1005.4, ISNI 0000 0004 4902 0432, ARC Centre of Excellence in Future Low-Energy Electronics Technologies (FLEET), , UNSW Sydney, ; Sydney, NSW 2052 Australia
                Author information
                http://orcid.org/0000-0003-3725-4912
                http://orcid.org/0000-0001-8610-1897
                http://orcid.org/0000-0003-2469-5807
                http://orcid.org/0000-0001-5096-2046
                http://orcid.org/0000-0003-2814-3241
                http://orcid.org/0000-0001-7613-1734
                http://orcid.org/0000-0001-5583-0587
                Article
                45482
                10.1038/s41467-024-45482-x
                10850082
                38326391
                9f72a401-ae90-4a07-9707-14dcb24be8e4
                © The Author(s) 2024

                Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

                History
                : 23 May 2023
                : 25 January 2024
                Funding
                Funded by: FundRef https://doi.org/10.13039/501100001809, National Natural Science Foundation of China (National Science Foundation of China);
                Award ID: 62274128
                Award Recipient :
                Funded by: FundRef https://doi.org/10.13039/501100004731, Natural Science Foundation of Zhejiang Province (Zhejiang Provincial Natural Science Foundation);
                Award ID: LDT23F04023F04
                Award Recipient :
                Funded by: National Key R&D Program of China under Grant No. 2023YFB4402303; Fundamental Research Funds for the Central Universities under Grant No. QTZX23079; Key Research and Development Program of Ningbo City under No. 2023Z071
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                © Springer Nature Limited 2024

                Uncategorized
                electronic devices,two-dimensional materials
                Uncategorized
                electronic devices, two-dimensional materials

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