Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Mahajan, Ravi Prakash; Li, Xiaoqian; Fryman, Joshua; Zhang, Zhichao; Nekkanty, Srikant; Tadayon, Pooya; Jaussi, James E.; Shumarayev, Sergey; Agrawal, Ankur; Jadhav, Susheel; Singh, Kumar Abhishek; Alduino, Andrew; Gujjula, Sushrutha; Chiu, Chia‐Pin; Nordstog, Thomas; Hosseini, Kaveh J.; Sane, Sandeep; Deshpande, Nitin; Aygün, Kemal; Sarkar, Arnab; Dobriyal, Priyanka; Pothukuchi, Suresh; Pogue, Vanessa; Hui, David

doi:10.1109/JLT.2021.3104725

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Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Author(s): Ravi Mahajan ¹ , Xiaoqian Li ² , Joshua Fryman ² , Zhichao Zhang ² , Srikant Nekkanty ² , Pooya Tadayon ² , James Jaussi ² , Sergey Shumarayev ² , Ankur Agrawal ² , Susheel Jadhav ² , Kumar Abhishek Singh ² , Andrew Alduino ² , Sushrutha Gujjula ² , Chia-Pin Chiu ² , Thomas Nordstog ² , Kaveh J. Hosseini ² , Sandeep Sane ² , Nitin Deshpande ² , Kemal Aygun ² , Arnab Sarkar ² , Priyanka Dobriyal ² , Suresh Pothukuchi ² , Vanessa Pogue ² , David Hui ²

Publication date (Print): January 15 2022

Journal: Journal of Lightwave Technology

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

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A 3-D-Integrated Silicon Photonic Microring-Based 112-Gb/s PAM-4 Transmitter With Nonlinear Equalization and Thermal Control

Hao Li, Ganesh Balamurugan, Taehwan Kim … (2021)

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1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration

Saeed Fathololoumi, David Hui, Susheel Jadhav … (2021)

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TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O

Mark Wade, Erik Anderson, Shahab Ardalan … (2020)

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Author and article information

Contributors

Ravi Mahajan: (View ORCID Profile)

Zhichao Zhang: (View ORCID Profile)

Chia-Pin Chiu: (View ORCID Profile)

Journal

Title: Journal of Lightwave Technology

Abbreviated Title: J. Lightwave Technol.

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

ISSN (Print): 0733-8724

ISSN (Electronic): 1558-2213

Publication date Created: January 15 2022

Publication date (Print): January 15 2022

Volume: 40

Issue: 2

Pages: 379-392

Affiliations

[1 ]Assembly and Test Technology Department of Intel Corporation, Chandler, AZ, USA

[2 ]Intel Corporation Santa Clara, CA, USA

Article

DOI: 10.1109/JLT.2021.3104725

SO-VID: 92ab7a7e-5a57-43b6-a3ea-fcf83ee2a315

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https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html

https://doi.org/10.15223/policy-029

https://doi.org/10.15223/policy-037

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Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

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Electronic Workshops in Computing (eWiC)

Most cited references 30

A 3-D-Integrated Silicon Photonic Microring-Based 112-Gb/s PAM-4 Transmitter With Nonlinear Equalization and Thermal Control

1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration

TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O

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