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Long term isothermal reliability of copper wire bonded to thin 6 5 µ m aluminum
Author(s):
F.C. Classe
,
Sesha Gaddamraja
Publication date:
2011
Journal:
2011 International Reliability Physics Symposium
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UCL: UN SDG 06 Clean Water and Sanitation
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DOI::
10.1109/irps.2011.5784557
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