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True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines
Author(s):
G. Scandurra
,
C. Ciofi
,
C. Pace
,
F. Speroni
,
F. Alagi
Publication date
Created:
September 2002
Publication date
(Print):
September 2002
Journal:
Microelectronics Reliability
Publisher:
Elsevier BV
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Digitizing Fabrication
Author and article information
Journal
Title:
Microelectronics Reliability
Abbreviated Title:
Microelectronics Reliability
Publisher:
Elsevier BV
ISSN (Print):
00262714
Publication date Created:
September 2002
Publication date (Print):
September 2002
Volume
: 42
Issue
: 9-11
Pages
: 1347-1351
Article
DOI:
10.1016/S0026-2714(02)00147-6
SO-VID:
7f89b6ac-9184-4960-964c-ac8cc6f88f81
Copyright ©
© 2002
License:
https://www.elsevier.com/tdm/userlicense/1.0/
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