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      Unlocking the monolithic integration scenario: optical coupling between GaSb diode lasers epitaxially grown on patterned Si substrates and passive SiN waveguides

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          Abstract

          Silicon (Si) photonics has recently emerged as a key enabling technology in many application fields thanks to the mature Si process technology, the large silicon wafer size, and promising Si optical properties. The monolithic integration by direct epitaxy of III–V lasers and Si photonic devices on the same Si substrate has been considered for decades as the main obstacle to the realization of dense photonics chips. Despite considerable progress in the last decade, only discrete III–V lasers grown on bare Si wafers have been reported, whatever the wavelength and laser technology. Here we demonstrate the first semiconductor laser grown on a patterned Si photonics platform with light coupled into a waveguide. A mid-IR GaSb-based diode laser was directly grown on a pre-patterned Si photonics wafer equipped with SiN waveguides clad by SiO 2. Growth and device fabrication challenges, arising from the template architecture, were overcome to demonstrate more than 10 mW outpower of emitted light in continuous wave operation at room temperature. In addition, around 10% of the light was coupled into the SiN waveguides, in good agreement with theoretical calculations for this butt-coupling configuration. This work lift an important building block and it paves the way for future low-cost, large-scale, fully integrated photonic chips.

          Abstract

          Artist view of a GaSb diode laser grown on a Si-photonics integrated circuit, with the emitted light coupled into passive SiN waveguides.

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                Author and article information

                Contributors
                eric.tournie@umontpellier.fr
                Journal
                Light Sci Appl
                Light Sci Appl
                Light, Science & Applications
                Nature Publishing Group UK (London )
                2095-5545
                2047-7538
                16 June 2023
                16 June 2023
                2023
                : 12
                : 150
                Affiliations
                [1 ]GRID grid.461998.b, ISNI 0000 0004 0390 3782, IES, University of Montpellier, CNRS, ; F-34000 Montpellier, France
                [2 ]GRID grid.4466.0, ISNI 0000 0001 0578 5482, Department of Electrical and Information Engineering, , Polytechnic University of Bari, ; 4 Via E. Orabona, IT- 70126 Bari, Italy
                [3 ]GRID grid.7872.a, ISNI 0000000123318773, Tyndall National Institute, Lee Maltings Complex, ; Dyke Parade, IR-T12R5CP Cork, Ireland
                [4 ]GRID grid.510393.d, ISNI 0000 0004 9343 1765, Centre for Advanced Photonics and Process Analysis, , Munster Technological University, ; Bishopstown, IR-T12P928 Cork, Ireland
                Author information
                http://orcid.org/0000-0001-8590-6634
                http://orcid.org/0000-0002-0125-6142
                http://orcid.org/0000-0002-0245-8563
                http://orcid.org/0000-0002-3232-673X
                http://orcid.org/0000-0002-1906-8772
                http://orcid.org/0000-0001-7961-4459
                http://orcid.org/0000-0003-1160-7441
                http://orcid.org/0000-0002-1758-7130
                http://orcid.org/0000-0002-1930-1984
                http://orcid.org/0000-0002-8177-0810
                Article
                1185
                10.1038/s41377-023-01185-4
                10276042
                37328485
                7337a53f-af38-4bef-99e5-b3f8d7d96696
                © The Author(s) 2023

                Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

                History
                : 25 November 2022
                : 27 April 2023
                : 16 May 2023
                Funding
                Funded by: FundRef https://doi.org/10.13039/501100001665, Agence Nationale de la Recherche (French National Research Agency);
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award ID: ANR-11-EQPX-0016
                Award ID: ANR-19-CE24-0002
                Award Recipient :
                Funded by: FundRef https://doi.org/10.13039/100010669, EC | EU Framework Programme for Research and Innovation H2020 | H2020 Priorioty Industrial Leadership | H2020 Industrial Leadership - Leadership in Enabling and Industrial Technologies | H2020 LEIT Information and Communication Technologies (H2020 Leadership in Enabling and Industrial Technologies - Information and Communication Technologies);
                Award ID: 780240
                Award ID: 860808
                Award ID: 780240
                Award ID: 860808
                Award ID: 780240
                Award ID: 860808
                Award ID: 860808
                Award ID: 780240
                Award ID: 860808
                Award ID: 780240
                Award ID: 860808
                Award ID: 780240
                Award ID: 860808
                Award ID: 780240
                Award ID: 860808
                Award ID: 780240
                Award ID: 860808
                Award ID: 780240
                Award ID: 860808
                Award Recipient :
                Funded by: FundRef https://doi.org/10.13039/100010689, EC | EU Framework Programme for Research and Innovation H2020 | H2020 Priorioty Industrial Leadership | H2020 Industrial Leadership - Leadership in Enabling and Industrial Technologies | H2020 LEIT Biotechnology (H2020 Leadership in Enabling and Industrial Technologies - Biotechnology);
                Award ID: 780240
                Award Recipient :
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                © Changchun Institute of Optics, Fine Mechanics and Physics (CIOMP), CAS 2023

                semiconductor lasers,silicon photonics
                semiconductor lasers, silicon photonics

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