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Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics
Author(s):
S. Oterkus
,
E Madenci
,
E Oterkus
,
Y. HWANG
,
J. BAE
,
S HAN
Publication date:
Journal:
Proceedings of the 64th Electronic Components and Technology Conference (ECTC), Walt Disney Swan & Dolphin Orlando
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