The numerical study on performance evaluation of a thermal switch capacitor in a magnetocaloric cooling device

Summary

Compact, solid thermal control devices offer a new way to control the intensity and direction of heat flow between the components of a system, which is crucial for both optimized performance and safety. In this work we study a thin, silicon thermal switch capacitor (TSC) used for heat transport in a magnetocaloric cooling system. A numerical model was developed to quantify the effects of various operating conditions and design parameters on the performance of a magnetocaloric device with an embedded TSC. Based on realistic material properties, a maximum cooling-power density of 4000 Wm ^-2 (2025 ${\text{Wkg}}_{mcm}^{-1}$ ) was obtained for a zero temperature span and an operating frequency of 20 Hz. The use of the presented device was demonstrated on a battery system, motivating further experimental studies to develop a new, compact cooling device that can be directly attached to a heat reservoir, making it desirable for a variety of applications.

Graphical abstract

Highlights

• •

  The performance of a unique TSC embedded in an MC device was investigated numerically

• •

  A cooling-power density of 2025 ${\text{Wkg}}_{mcm}^{-1}$ was achieved at 20 Hz and zero temperature span

• •

  The highest rectification ratio and temperature span achieved were 3.8 and 2.8 K

• •

  The potential use of the proposed device was demonstrated on a battery system

Abstract

Materials science; Thermal engineering; Thermal property