Flexible and Robust Functionalized Boron Nitride/Poly( p-Phenylene Benzobisoxazole) Nanocomposite Paper with High Thermal Conductivity and Outstanding Electrical Insulation

Highlights

• m-BN/PNF nanocomposite paper with nacre-mimetic layered structures prepared via sol–gel film transformation approach presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical property and thermal stability.

• When the mass fraction of m-BN is 50 wt%, m-BN/PNF nanocomposite paper exhibits excellent thermal conductivity and electrical insulation. The λ _∥ and λ _⊥ are 9.68 and 0.84 W m ⁻¹ K ⁻¹, and the volume resistivity and breakdown strength are as high as 2.3 × 10 ¹⁵ Ω cm and 324.2 kV mm ⁻¹, respectively.

• The m-BN/PNF nanocomposite paper with 50 wt% m-BN also presents outstanding mechanical properties (tensile strength of 193.6 MPa) and thermal stability (thermal decomposition temperature of 640 °C).

Supplementary Information

The online version contains supplementary material available at 10.1007/s40820-023-01257-5.

Abstract

With the rapid development of 5G information technology, thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent. In this work, “high-temperature solid-phase & diazonium salt decomposition” method is carried out to prepare benzidine-functionalized boron nitride ( m-BN). Subsequently, m-BN/poly( p-phenylene benzobisoxazole) nanofiber (PNF) nanocomposite paper with nacre-mimetic layered structures is prepared via sol–gel film transformation approach. The obtained m-BN/PNF nanocomposite paper with 50 wt% m-BN presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical properties and thermal stability, due to the construction of extensive hydrogen bonds and π–π interactions between m-BN and PNF, and stable nacre-mimetic layered structures. Its λ _∥ and λ _⊥ are 9.68 and 0.84 W m ⁻¹ K ⁻¹, and the volume resistivity and breakdown strength are as high as 2.3 × 10 ¹⁵ Ω cm and 324.2 kV mm ⁻¹, respectively. Besides, it also presents extremely high tensile strength of 193.6 MPa and thermal decomposition temperature of 640 °C, showing a broad application prospect in high-end thermal management fields such as electronic devices and electrical equipment.

Supplementary Information

The online version contains supplementary material available at 10.1007/s40820-023-01257-5.