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      Effect of Electron-Phonon Coupling on Thermal Transport across Metal-Nonmetal Interface - A Second Look

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          Abstract

          The effect of electron-phonon (e-ph) coupling on thermal transport across metal-nonmetal interfaces is yet to be completely understood. In this paper, we use a series of molecular dynamics (MD) simulations with e-ph coupling effect included by Langevin dynamics to calculate the thermal conductance at a model metal-nonmetal interface. It is found that while e-ph coupling can present additional thermal resistance on top of the phonon-phonon thermal resistance, it can also make the phonon-phonon thermal conductance larger than the pure phonon transport case. This is because the e-ph interaction can disturb the phonon subsystem and enhance the energy communication between different phonon modes inside the metal. This facilitates redistributing phonon energy into modes that can more easily transfer energy across the interfaces. Compared to the pure phonon thermal conduction, the total thermal conductance with e-ph coupling effect can become either smaller or larger depending on the coupling factor. This result helps clarify the role of e-ph coupling in thermal transport across metal-nonmetal interface.

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          Including the effects of electronic stopping and electron–ion interactions in radiation damage simulations

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            Author and article information

            Journal
            2014-12-08
            2015-04-10
            Article
            10.1209/0295-5075/110/67004
            1412.2791
            35dadadb-c319-4d7c-8d9f-c6fb12d4b711

            http://arxiv.org/licenses/nonexclusive-distrib/1.0/

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            Custom metadata
            Europhysics Letter 2015, Volume 110, Number 6
            cond-mat.mtrl-sci

            Condensed matter
            Condensed matter

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