An overview of through-silicon-via technology and manufacturing challenges

Adderly, Shawn A.; Gambino, Jeffrey P.; Knickerbocker, John U.

doi:10.1016/j.mee.2014.10.019

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An overview of through-silicon-via technology and manufacturing challenges

Author(s): Jeffrey P. Gambino , Shawn A. Adderly , John U. Knickerbocker

Publication date Created: March 2015

Publication date (Print): March 2015

Journal: Microelectronic Engineering

Publisher: Elsevier BV

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Title: Microelectronic Engineering

Abbreviated Title: Microelectronic Engineering

Publisher: Elsevier BV

ISSN (Print): 01679317

Publication date Created: March 2015

Publication date (Print): March 2015

Volume: 135

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Pages: 73-106

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DOI: 10.1016/j.mee.2014.10.019

SO-VID: 33837c50-868f-4a29-b0f5-64a6492f32d2

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http://www.elsevier.com/tdm/userlicense/1.0/

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An overview of through-silicon-via technology and manufacturing challenges

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