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      Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application

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      Author(s): , , , ,
      Publication date (Print):
      Conference name: 2010 IEEE Nanotechnology Materials and Devices Conference (NMDC)
      Conference date: November 12, 2010 - November 15, 2010

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          Conference
          Publication date: October 2010
          Publication date (Print): October 2010
          Pages: 262-266
          Article
          DOI: 10.1109/NMDC.2010.5652157
          SO-VID: 2306644f-19c3-489a-a862-069dc6313476
          Copyright © © 2010
          Conference name: 2010 IEEE Nanotechnology Materials and Devices Conference (NMDC)
          Conference location: Monterey, CA, USA
          Conference date: November 12, 2010 - November 15, 2010
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