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      Effects of physico-chemical properties between poly(ethyleneimine) and silica abrasive on copper chemical mechanical planarization

      Author(s): , , , , ,
      Publication date Created:
      Publication date (Print):
      Journal: Microelectronic Engineering
      Publisher: Elsevier BV

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          Journal
          Title: Microelectronic Engineering
          Abbreviated Title: Microelectronic Engineering
          Publisher: Elsevier BV
          ISSN (Print): 01679317
          Publication date Created: January 2014
          Publication date (Print): January 2014
          Volume: 113
          Pages: 50-54
          Article
          DOI: 10.1016/j.mee.2013.07.006
          SO-VID: 1d9cdf54-b7c2-4a40-989e-175b962fb54c
          Copyright © © 2014
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