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      Deformation-tolerant, wireless-charging microbatteries for seamlessly integrated omnidirectional stretchable electronics

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          Abstract

          Wireless-charging in-plane microbatteries (MBs) with conformal shape and high-capacity hold substantial promise in advancing the practical applications of complexly configured electronic devices. However, integrating these MBs seamlessly with flexible electronic system remains a challenge as it requires a rational structure design and reasonable materials engineering for the micropower system, ensuring both high compatibility and robust mechanical stability. Here, we present stretchable and wireless-charging dual-plating MBs that integrate seamlessly into circuits through an omnidirectional stretch-contraction strategy coupled with mask-assisted printing. The strain-induced folding structures and no active-material design endow the wireless-charging MBs with reliable deformation-tolerant capabilities, which can sustain ~200% omnidirectional strains and have advantages of an order of magnitude in terms of power and energy densities, compared to the existing in-plane MBs. With the exceptional compatible and elastic properties, a wirelessly charging stretchable display integrated circuit and even intelligent electronic skin are achieved, capable of mimicking human touch to sense the weight, temperature, and shape of objects.

          Abstract

          Deformable wireless-charging microbatteries seamlessly integrate with stretchable electronics by stretch-contraction strategy.

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          Most cited references55

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          Skin-integrated wireless haptic interfaces for virtual and augmented reality

          Traditional technologies for virtual reality (VR) and augmented reality (AR) create human experiences through visual and auditory stimuli that replicate sensations associated with the physical world. The most widespread VR and AR systems use head-mounted displays, accelerometers and loudspeakers as the basis for three-dimensional, computer-generated environments that can exist in isolation or as overlays on actual scenery. In comparison to the eyes and the ears, the skin is a relatively underexplored sensory interface for VR and AR technology that could, nevertheless, greatly enhance experiences at a qualitative level, with direct relevance in areas such as communications, entertainment and medicine1,2. Here we present a wireless, battery-free platform of electronic systems and haptic (that is, touch-based) interfaces capable of softly laminating onto the curved surfaces of the skin to communicate information via spatio-temporally programmable patterns of localized mechanical vibrations. We describe the materials, device structures, power delivery strategies and communication schemes that serve as the foundations for such platforms. The resulting technology creates many opportunities for use where the skin provides an electronically programmable communication and sensory input channel to the body, as demonstrated through applications in social media and personal engagement, prosthetic control and feedback, and gaming and entertainment.
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            Long cycle life and dendrite-free lithium morphology in anode-free lithium pouch cells enabled by a dual-salt liquid electrolyte

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              • Record: found
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              Microsupercapacitors as miniaturized energy-storage components for on-chip electronics

              This Review discusses the technical challenges and performance metrics to integrate micro-supercapacitors into miniaturized electronic devices.
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                Author and article information

                Contributors
                Role: ConceptualizationRole: Formal analysisRole: InvestigationRole: MethodologyRole: ValidationRole: Writing - original draft
                Role: ConceptualizationRole: Data curationRole: Formal analysisRole: Funding acquisitionRole: InvestigationRole: MethodologyRole: Project administrationRole: SupervisionRole: ValidationRole: Writing - original draftRole: Writing - review & editing
                Role: Formal analysis
                Role: MethodologyRole: SoftwareRole: ValidationRole: VisualizationRole: Writing - original draftRole: Writing - review & editing
                Role: Formal analysis
                Role: Formal analysis
                Role: Formal analysis
                Role: Formal analysis
                Role: InvestigationRole: Resources
                Role: Formal analysisRole: Methodology
                Role: Formal analysis
                Role: ConceptualizationRole: Funding acquisitionRole: Project administrationRole: Writing - original draft
                Journal
                Sci Adv
                Sci Adv
                sciadv
                advances
                Science Advances
                American Association for the Advancement of Science
                2375-2548
                21 February 2025
                19 February 2025
                : 11
                : 8
                : eads6892
                Affiliations
                [ 1 ]Key Laboratory of Organic Optoelectronics & Molecular Engineering of Ministry of Education, State Key Laboratory of Flexible Electronics Technology, Department of Chemistry, Tsinghua University, Beijing 100084, China.
                [ 2 ]Key Laboratory of Cluster Science, Ministry of Education of China, Beijing, Key Laboratory of Photoelectronic/Electrophotonic Conversion Materials, School of Chemistry and Chemical Engineering, Beijing Institute of Technology, Beijing 100081, China.
                [ 3 ]State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, P. R. China.
                [ 4 ]College of Materials Science and Engineering, Sichuan University, Chengdu 610065, P. R. China.
                [ 5 ]Interdisciplinary Research Center for Sustainable Energy Science and Engineering (IRC4SE2), School of Chemical Engineering, Zhengzhou University, Zhengzhou 450001, P. R. China.
                [ 6 ]School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing 100044, China.
                [ 7 ]Laser Micro/Nano-Fabrication Laboratory, School of Mechanical Engineering, Beijing Institute of Technology, Beijing 100081, P. R. China.
                Author notes
                [* ]Corresponding author. Email: lqu@ 123456mail.tsinghua.edu.cn (L.Q.); yzhao@ 123456bit.edu.cn (Y.Z.)
                Author information
                https://orcid.org/0000-0002-9739-0273
                https://orcid.org/0000-0002-8187-9963
                https://orcid.org/0000-0003-1263-7087
                https://orcid.org/0000-0002-4830-4025
                https://orcid.org/0000-0001-9987-782X
                https://orcid.org/0000-0002-0161-3816
                Article
                ads6892
                10.1126/sciadv.ads6892
                11837992
                19f0160c-63ec-4409-8235-8c23b9b8cae5
                Copyright © 2025 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).

                This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license, which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited.

                History
                : 24 August 2024
                : 16 January 2025
                Funding
                Funded by: FundRef http://dx.doi.org/10.13039/501100001809, National Natural Science Foundation of China;
                Award ID: 11972349
                Funded by: FundRef http://dx.doi.org/10.13039/501100001809, National Natural Science Foundation of China;
                Award ID: 22075019
                Funded by: FundRef http://dx.doi.org/10.13039/501100001809, National Natural Science Foundation of China;
                Award ID: 22035005
                Funded by: FundRef http://dx.doi.org/10.13039/501100001809, National Natural Science Foundation of China;
                Award ID: 22409115
                Funded by: FundRef http://dx.doi.org/10.13039/501100002858, China Postdoctoral Science Foundation;
                Award ID: 2023M741918
                Funded by: FundRef , Strategic Priority Research Program of the Chinese Academy of Sciences;
                Award ID: XDB0620101
                Funded by: FundRef , National Key Research and Development Program of China;
                Award ID: 2024YFB4609100
                Funded by: FundRef , State Sponsored Postdoctoral Researcher Program of China;
                Award ID: GZC20231253
                Funded by: FundRef , Beijing-tianjin-hebei Basic Research Cooperation;
                Award ID: B2024408025
                Categories
                Research Article
                Physical and Materials Sciences
                SciAdv r-articles
                Electrochemistry
                Materials Science
                Electrochemistry

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