PCB Reverse Engineering Using Nondestructive X-ray Tomography and Advanced Image Processing

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Journal

Title: IEEE Transactions on Components, Packaging and Manufacturing Technology

Abbreviated Title: IEEE Trans. Compon., Packag. Manufact. Technol.

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

ISSN (Print): 2156-3950

ISSN (Electronic): 2156-3985

Publication date (Print): 2017

Pages: 1-8

Article

DOI: 10.1109/TCPMT.2016.2642824

SO-VID: 15899091-dd84-4478-ad6d-0c318e79741d

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