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      Ultra-high performance wearable thermoelectric coolers with less materials

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          Abstract

          Thermoelectric coolers are attracting significant attention for replacing age-old cooling and refrigeration devices. Localized cooling by wearable thermoelectric coolers will decrease the usage of traditional systems, thereby reducing global warming and providing savings on energy costs. Since human skin as well as ambient air is a poor conductor of heat, wearable thermoelectric coolers operate under huge thermally resistive environment. The external thermal resistances greatly influence thermoelectric material behavior, device design, and device performance, which presents a fundamental challenge in achieving high efficiency for on-body applications. Here, we examine the combined effect of heat source/sink thermal resistances and thermoelectric material properties on thermoelectric cooler performance. Efficient thermoelectric coolers demonstrated here can cool the human skin up to 8.2 °C below the ambient temperature (170% higher cooling than commercial modules). Cost-benefit analysis shows that cooling over material volume for our optimized thermoelectric cooler is 500% higher than that of the commercial modules.

          Abstract

          Wearable thermoelectric coolers (TECs), whose performance depends on optimal module design and environmental thermal resistance, are an attractive next-generation technology for on-body applications. Here, the authors report an optimized wearable TEC with 170% higher cooling than commercial devices.

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          Most cited references48

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          Complex thermoelectric materials.

          Thermoelectric materials, which can generate electricity from waste heat or be used as solid-state Peltier coolers, could play an important role in a global sustainable energy solution. Such a development is contingent on identifying materials with higher thermoelectric efficiency than available at present, which is a challenge owing to the conflicting combination of material traits that are required. Nevertheless, because of modern synthesis and characterization techniques, particularly for nanoscale materials, a new era of complex thermoelectric materials is approaching. We review recent advances in the field, highlighting the strategies used to improve the thermopower and reduce the thermal conductivity.
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            Quantum dot superlattice thermoelectric materials and devices.

            PbSeTe-based quantum dot superlattice structures grown by molecular beam epitaxy have been investigated for applications in thermoelectrics. We demonstrate improved cooling values relative to the conventional bulk (Bi,Sb)2(Se,Te)3 thermoelectric materials using a n-type film in a one-leg thermoelectric device test setup, which cooled the cold junction 43.7 K below the room temperature hot junction temperature of 299.7 K. The typical device consists of a substrate-free, bulk-like (typically 0.1 millimeter in thickness, 10 millimeters in width, and 5 millimeters in length) slab of nanostructured PbSeTe/PbTe as the n-type leg and a metal wire as the p-type leg.
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              On-chip cooling by superlattice-based thin-film thermoelectrics.

              There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.
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                Author and article information

                Contributors
                ravi86@vt.edu
                sup103@psu.edu
                Journal
                Nat Commun
                Nat Commun
                Nature Communications
                Nature Publishing Group UK (London )
                2041-1723
                16 April 2019
                16 April 2019
                2019
                : 10
                : 1765
                Affiliations
                [1 ]ISNI 0000 0001 0694 4940, GRID grid.438526.e, Center for Energy Harvesting Materials and Systems, Virginia Tech, ; Blacksburg, VA 24061 USA
                [2 ]National Renewable Energy Laboratory, 15013 Denver West Pkwy, Golden, CO 80401 USA
                [3 ]ISNI 0000 0001 2097 4281, GRID grid.29857.31, Department of Materials Science and Engineering, , Pennsylvania State University, University Park, ; Pennsylvania, PA 16802 USA
                [4 ]Aviation and Missile Center, U.S. Army Combat Capabilities Development Command, Redstone Arsenal, Alabama, AL 35898 USA
                Author information
                http://orcid.org/0000-0003-2789-9469
                http://orcid.org/0000-0003-1367-3434
                Article
                9707
                10.1038/s41467-019-09707-8
                6468009
                30602773
                028936d3-dc72-4ba4-9968-088ec91c967b
                © The Author(s) 2019

                Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

                History
                : 27 October 2018
                : 18 March 2019
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