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Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Author(s):
John H. Lau
,
M. X. ZHANG
,
S. Ricky Lee
Publication date:
2011
Journal:
Journal of Electronic Packaging
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2023 Research and Innovation Open Distance and eLearning (ODeL) Hybrid Conference
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DOI::
10.1115/1.4004861
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