Journal ID (nlm-ta): Sci Adv
Journal ID (iso-abbrev): Sci Adv
Journal ID (publisher-id): SciAdv
Journal ID (hwp): advances
Title:
Science Advances
Publisher:
American Association for the Advancement of Science
ISSN
(Electronic):
2375-2548
Publication date Collection:
July
2020
Publication date
(Electronic):
10
July
2020
Volume: 6
Issue: 28
Electronic Location Identifier: eaba1178
Affiliations
[1
]KU-KIST Graduate School of Converging Science and Technology, Korea University, 145
Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea.
[2
]Institute of Advanced Composite Materials, Korea Institute of Science and Technology,
92 Chudong-ro, Bongdong-eup, Wanju-gun, Jeollabuk-do 55324, Republic of Korea.
[3
]Department of Flexible and Printable Electronics, Jeonbuk National University, 567
Baekje-daero, Deokjin-gu, Jeonju-si, Jeollabuk-do 54896, Republic of Korea.
Author notes
[*]
These authors contributed equally to this work.
[†]
Present address: Department of Flexible and Printable Electronics, Jeonbuk National
University, 567 Baekje-daero, Deokjin-gu, Jeonju-si, Jeollabuk-do 54896, Republic
of Korea.
Author information
Article
Publisher ID:
aba1178
DOI: 10.1126/sciadv.aba1178
PMC ID: 10662591
PubMed ID: 32937532
SO-VID: 88160c50-f29a-4026-b8f3-fe2c8e5416d9
Copyright © Copyright © 2020 The Authors, some rights reserved; exclusive licensee American Association
for the Advancement of Science. No claim to original U.S. Government Works. Distributed
under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).
License:
This is an open-access article distributed under the terms of the
Creative Commons Attribution-NonCommercial license, which permits use, distribution, and reproduction in any medium, so long as the
resultant use is
not for commercial advantage and provided the original work is properly cited.
Funded by:
doi http://dx.doi.org/10.13039/501100003725, National Research Foundation of Korea;
Award ID: 2019R1A2C2003704
Funded by:
doi http://dx.doi.org/10.13039/501100003725, National Research Foundation of Korea;
Award ID: 2019R1A6A3A01095700
Funded by:
doi http://dx.doi.org/10.13039/501100003725, National Research Foundation of Korea;
Award ID: 2020R1A2C2010163
Funded by:
Samsung Electronics;
Funded by:
the KU-KIST research fund;
Funded by:
Korea University Grant;
Subject:
Research Article
Subject:
Research Articles
Subject:
SciAdv r-articles
Subject:
Materials Science
Subject:
Applied Sciences and Engineering
Subject:
Applied Sciences and Engineering