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      Polydispersity vs. Monodispersity. How the Properties of Ni-Ag Core-Shell Nanoparticles Affect the Conductivity of Ink Coatings

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          Abstract

          The effect of polydispersity of nickel-silver core-shell nanoparticles (Ni-Ag NPs) on the conductivity of ink coatings was studied. Ni-Ag NPs of various average diameters (100, 220, and 420 nm) were synthesized and utilized for the preparation of conductive inks composed of monodisperse NPs and their polydisperse mixtures. The shell thickness of synthesized Ni-Ag NPs was found to be in the range of 10–20 nm and to provide stability of a core metal to oxidation for at least 6 months. The conductivity of metallic films formed by inks with monodisperse Ni-Ag NPs was compared with those formed by polydisperse inks. In all cases, the optimal conditions for the formation of conductive patterns (weight ratio of monodisperse NPs for polydisperse composition, the concentration of the wetting agent, sintering temperature, and duration) were determined. It was found that metallic films formed by polydisperse ink containing 100, 220, and 420 nm Ni-Ag NPs with a mass ratio of 1:1.5:0.5, respectively, are characterized by the lowest resistivity, 10.9 µΩ·cm, after their thermal post-coating sintering at 300 °C for 30 min that is only 1.6 higher than that of bulk nickel.

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          Most cited references31

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          Conductive nanomaterials for printed electronics.

          This is a review on recent developments in the field of conductive nanomaterials and their application in printed electronics, with particular emphasis on inkjet printing of ink formulations based on metal nanoparticles, carbon nanotubes, and graphene sheets. The review describes the basic properties of conductive nanomaterials suitable for printed electronics (metal nanoparticles, carbon nanotubes, and graphene), their stabilization in dispersions, formulations of conductive inks, and obtaining conductive patterns by using various sintering methods. Applications of conductive nanomaterials for electronic devices (transparent electrodes, metallization of solar cells, RFID antennas, TFTs, and light emitting devices) are also briefly reviewed.
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            Control of colloidal particle deposit patterns within picoliter droplets ejected by ink-jet printing.

            Particle deposit morphologies that resulted from evaporating ink-jetted microdroplets were controlled by varying the ink compositions and concentrations. The ink was a well-dispersed aqueous dispersion of monodisperse silica microspheres. Silica particles suspended in the microdroplet undergo self-assembly upon the evaporation of the solvent. A ringlike deposit of the self-assembled silica particles was produced from the water-based ink, while a uniform two-dimensional monolayer with a well-ordered hexagonal structure was obtained from the mixed-solvent-based inks. Variations in the deposit patterns can be explained in terms of competing effects between the convective and Marangoni flows, which vary with the types of the high-boiling-point solvent added to the ink. The macroscopic shape and microstructure of the silica colloidal deposits were observed by SEM, AFM, and a confocal microscope.
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              Conductive nanomaterials for 2D and 3D printed flexible electronics

              This review describes recent developments in the field of conductive nanomaterials and their application in 2D and 3D printed flexible electronics, with particular emphasis on inks based on metal nanoparticles and nanowires, carbon nanotubes, and graphene sheets. This review describes recent developments in the field of conductive nanomaterials and their application in 2D and 3D printed flexible electronics, with particular emphasis on inks based on metal nanoparticles and nanowires, carbon nanotubes, and graphene sheets. We present the basic properties of these nanomaterials, their stabilization in dispersions, formulation of conductive inks and formation of conductive patterns on flexible substrates (polymers, paper, textile) by using various printing technologies and post-printing processes. Applications of conductive nanomaterials for fabrication of various 2D and 3D electronic devices are also briefly discussed.
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                Author and article information

                Contributors
                Role: Academic Editor
                Journal
                Materials (Basel)
                Materials (Basel)
                materials
                Materials
                MDPI
                1996-1944
                29 April 2021
                May 2021
                : 14
                : 9
                : 2304
                Affiliations
                [1 ]Jerzy Haber Institute of Catalysis and Surface Chemistry Polish Academy of Sciences, Niezapominajek 8, 30239 Kraków, Poland; stasko.d@ 123456outlook.com (D.S.); nbmordar@ 123456cyf-kr.edu.pl (G.M.); ncszczep@ 123456cyf-kr.edu.pl (K.S.)
                [2 ]Abraxas Jeremiasz Olgierd, Piaskowa 27, 44300 Wodzisław Śląski, Poland; radek.pawlowski@ 123456helioenergia.com
                [3 ]Casali Center for Applied Chemistry, Institute of Chemistry, Edmond J. Safra Campus, The Hebrew University of Jerusalem, Jerusalem 91904, Israel; alexander.kamyshny@ 123456mail.huji.ac.il
                Author notes
                [* ]Correspondence: ncpajor@ 123456cyf-kr.edu.pl
                Author information
                https://orcid.org/0000-0002-9927-5869
                Article
                materials-14-02304
                10.3390/ma14092304
                8125038
                33946794
                8cf16ad4-b9fb-4fba-968d-8d02ca0c9fc4
                © 2021 by the authors.

                Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license ( https://creativecommons.org/licenses/by/4.0/).

                History
                : 29 March 2021
                : 26 April 2021
                Categories
                Article

                core-shell nanoparticles,monodispersity and polydispersity,thermal sintering,conductive properties

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